Development of Printable Graphene/Ag Nanowire Conductive Ink for Electromagnetic Wave Absorption
DOI:
https://doi.org/10.62239/jca.2026.016Abstract
This study reports the formulation and implementation of a graphene/Ag nanowire (AgNW) hybrid conductive ink tailored for printed metamaterial-based electromagnetic (EM) wave absorbers. Graphene nanoplatelets (5 - 20 µm lateral size) provide abundant interfaces and dielectric loss, while high–aspect-ratio Ag nanowires (50 - 100 nm diameter, micrometer-scale length) establish efficient conductive pathways at low filler content. The ink shows good dispersion stability and printability, enabling accurate pattern transfer onto paper substrates. A cross-shaped metasurface geometry (l₁ = 18 mm, l₂ = 15 mm, w₁ = 8 mm) is employed to investigate absorber behavior. Microstructural characterization confirms the formation of an interconnected 2D–1D network, favorable for charge transport and electromagnetic loss. Measured and simulated results indicate effective EM energy dissipation and stable absorption under oblique incidence conditions up to 60°. The proposed ink system and printing approach offer a practical route for lightweight, flexible, and scalable EM absorber fabrication.Downloads
References
Z. Wei, Z. Li, D. Chen, J. Liang, J. Kong, Small Struct., 6(7) (2025) 2400615. https://doi.org/10.1002/sstr.202400615
A. Parveen, A. Irshad, M.N.U. Shah, A.U. Rahman, D. Tyagi, M. Alam, S. Ullah, J. Tao, Adv. Mater. Technol., 10(20) (2025) e00710. https://doi.org/10.1002/admt.202500710
Y. Duan, H. Guan, Microwave Absorbing Materials, Jenny Stanford Publishing, New York (2016).
Y. Xia, W. Gao, C. Gao, Adv. Funct. Mater., 32(42) (2022) 2204591. https://doi.org/10.1002/adfm.202204591
J. Ren, P. Shi, X. Zu, L. Ding, F. Liu, Y. Wang, W. Guo, Nanoscale, 17(22) (2025) 13622-13645. https://doi.org/10.1039/D5NR00925A
T.T. Le, H.H.T. Bui, A.K.P. Dinh, D.V. Van, Q.D. Ho, H.A.N. Thi, T.T. Nguyen, ChemistrySelect, 7(4) (2022) e202104249. https://doi.org/10.1002/slct.202104249
P.T.H. Nguyen, Q.H. Nguyen, S.T. Huynh, T.H. Mai, T.T. Nguyen, T.S. Bui, M.T. Le, D.D. La, J. Electron. Mater., 54 (2025) 3949-3956. https://doi.org/10.1007/s11664-025-11822-w
J. Wiklund, A. Karakoç, T. Palko, H. Yiğitler, K. Ruttik, R. Jäntti, J. Paltakari, J. Manuf. Mater. Process., 5(3) (2021) 89. https://doi.org/10.3390/jmmp5030089
X. Wu, Z. Zhou, Y. Wang, J. Li, Coatings, 10(9) (2020) 865. https://doi.org/10.3390/coatings10090865
N. Sharma, N.M. Nair, G. Nagasarvari, D. Ray, P. Swaminathan, Flex. Print. Electron., 7(1) (2022) 014009. https://doi.org/10.1088/2058-8585/ac53b4
D. Fu, R. Yang, Y. Wang, R. Wang, F. Hua, Adv. Mater. Technol., 7(11) (2022) 2200027. https://doi.org/10.1002/admt.202200027
D. Lee, H. Lee, Y. Ahn, Y. Lee, Carbon, 81 (2015) 439-446. https://doi.org/10.1016/j.carbon.2014.09.076









