PASSIVE FILMS FORMED ON THE NANOSTRUCTURED Ni AND Ni-Cu COATINGS IN THE BORATE SOLUTION

Abstract

Passive films formed on the nanostructured Ni and Ni-Cu coatings in the borate solution were investigated. The diffusion of the point defects (D₀) in the passive film formed on the Ni coating was calculated to be 2.17 × 10-17 cm²/s and 1.76 × 10-17 cm²/s for Ni-Cu. The thickness of passive film and the diffusion of the point defects on passive film formed Ni-Cu coating lower than that from the Ni coating; this means, in the borate solution, the Ni-Cu coating more corrosion resistant than the Ni coating.